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 HZS-L Series
Silicon Epitaxial Planar Zener Diode for Low Noise Application
REJ03G0166-0200Z (Previous: ADE-208-121A) Rev.2.00 Jan.06.2004
Features
* Diode noise level of this series is approximately 1/3-1/10 lower than the HZ series. * Low leakage, low zener impedance and maximum power dissipation of 400 mW are ideally suited for stabilized power supply, etc. * Wide spectrum from 5.2V through 38V of zener voltage provide flexible application. * Suitable for 5mm-pitch high speed automatic insertion.
Ordering Information
Type No. HZS-L Series Mark Type No. Package Code MHD
Pin Arrangement
B
7
2
1
2
Type No. Cathode band 1. Cathode 2. Anode
Rev.2.00, Jan.06.2003, page 1 of 6
HZS-L Series
Absolute Maximum Ratings
(Ta = 25C)
Item Power dissipation Junction temperature Storage temperature Symbol Pd Tj Tstg Value 400 200 -55 to +175 Unit mW C C
Electrical Characteristics
(Ta = 25C)
Zener Voltage VZ (V)* Type HZS6L Grade A1 A2 A3 B1 B2 B3 C1 C2 C3 HZS7L A1 A2 A3 B1 B2 B3 C1 C2 C3 Note: Min 5.2 5.3 5.4 5.5 5.6 5.7 5.8 6.0 6.1 6.3 6.4 6.6 6.7 6.9 7.0 7.2 7.3 7.5
1
Reverse Current Test Condition IR (A) Max 1 Test Condition VR (V) 2.0
Dynamic Resistance rd () Max 150 Test Condition IZ (mA) 0.5
Max 5.5 5.6 5.7 5.8 5.9 6.0 6.1 6.3 6.4 6.6 6.7 6.9 7.0 7.2 7.3 7.6 7.7 7.9
IZ (mA) 0.5
80
0.5
60
0.5
0.5
1
3.5
60
0.5
1. Tested with DC.
Rev.2.00, Jan.06.2003, page 2 of 6
HZS-L Series
Zener Voltage VZ (V)* Type HZS9L Grade A1 A2 A3 B1 B2 B3 C1 C2 C3 HZS11L A1 A2 A3 B1 B2 B3 C1 C2 C3 HZS12L A1 A2 A3 B1 B2 B3 C1 C2 C3 HZS15L 1 2 3 HZS16L 1 2 3 Note: Min 7.7 7.9 8.1 8.3 8.5 8.7 8.9 9.1 9.3 9.5 9.7 9.9 10.2 10.4 10.7 10.9 11.1 11.4 11.6 11.9 12.2 12.4 12.6 12.9 13.2 13.5 13.8 14.1 14.5 14.9 15.3 15.7 16.3
1
Reverse Current Test Condition IR (A) Max 1 Test Condition VR (V) 6.0
Dynamic Resistance rd () Max 60 Test Condition IZ (mA) 0.5
Max 8.1 8.3 8.5 8.7 8.9 9.1 9.3 9.5 9.7 9.9 10.1 10.3 10.6 10.8 11.1 11.3 11.6 11.9 12.1 12.4 12.7 12.9 13.1 13.4 13.7 14.0 14.3 14.7 15.1 15.5 15.9 16.5 17.1
IZ (mA) 0.5
0.5
1
8.0
80
0.5
0.5
1
10.5
80
0.5
0.5
1
13.0
80
0.5
0.5
1
14.0
80
0.5
1. Tested with DC.
Rev.2.00, Jan.06.2003, page 3 of 6
HZS-L Series
Zener Voltage VZ (V)* Type HZS18L Grade 1 2 3 HZS20L 1 2 3 HZS22L 1 2 3 HZS24L 1 2 3 HZS27L 1 2 3 HZS30L 1 2 3 HZS33L 1 2 3 HZS36L 1 2 3 Min 16.9 17.5 18.1 18.8 19.5 20.2 20.9 21.6 22.3 22.9 23.6 24.3 25.2 26.2 27.2 28.2 29.2 30.2 31.2 32.2 33.2 34.2 35.3 36.4
1
Reverse Current Test Condition IR (A) Max 1 Test Condition VR (V) 15.0
Dynamic Resistance rd () Max 80 Test Condition IZ (mA) 0.5
Max 17.7 18.3 19.0 19.7 20.4 21.1 21.9 22.6 23.3 24.0 24.7 25.5 26.6 27.6 28.6 29.6 30.6 31.6 32.6 33.6 34.6 35.7 36.8 38.0
IZ (mA) 0.5
0.5
1
18.0
100
0.5
0.5
1
20.0
100
0.5
0.5
1
22.0
120
0.5
0.5
1
24.0
150
0.5
0.5
1
27.0
200
0.5
0.5
1
30.0
250
0.5
0.5
1
33.0
300
0.5
Notes: 1. Tested with DC. 2. Type No. is as follows; HZS6A1L, HZS6A2L, HZS36-3L
Rev.2.00, Jan.06.2003, page 4 of 6
HZS-L Series
Main Characteristic
10-2
HZS12B2L HZS20-2L
10-3
Zener Current IZ (A)
HZS16-2L
HZS24-2L
HZS6B2L
HZS9B2L
HZS30-2L
10-4 10-5 10-6 10-7 10-8
0
5
10
15
20
25
30
35
HZS36-2L
40
Zener Voltage VZ (V) Fig.1 Zener current vs. Zener voltage
Zener Voltage Temperature Coefficient Z (mV/C)
Zener Voltage Temperature Coefficient Z (%/C)
0.10 0.08 0.06 0.04 mV/C 0.02 0 -0.02 -0.04 -0.06 -0.08 -0.10 0 5 %/C
50 40 30 20 10 0 -10 -20 -30 -40 -50 10 15 20 25 30 35 40 Zener Voltage VZ (V)
500
l
2.5 mm 3 mm
Power Dissipation Pd (mW)
400
Printed circuit board 100 x 180 x 1.6t mm Quality: paper phenol
300
l = 5 mm
200
l = 10 mm (Publication value)
100
0
0
50
100
150
200
Ambient Temperature Ta (C) Fig.3 Power Dissipation vs. Ambient Temperature
Fig.2 Temperature Coefficient vs. Zener voltage
Rev.2.00, Jan.06.2003, page 5 of 6
HZS-L Series
Package Dimensions
As of January, 2003
Unit: mm
26.0 Min
2.4 Max
26.0 Min
0.4
2.0
Package Code JEDEC JEITA Mass (reference value)
MHD Conforms -- 0.084 g
Rev.2.00, Jan.06.2003, page 6 of 6
Sales Strategic Planning Div.
Keep safety first in your circuit designs!
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. Notes regarding these materials 1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party. 2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. 3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product information before purchasing a product listed herein. The information described here may contain technical inaccuracies or typographical errors. Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors. Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor home page (http://www.renesas.com). 4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes no responsibility for any damage, liability or other loss resulting from the information contained herein. 5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use. 6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials. 7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination. Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited. 8. Please contact Renesas Technology Corp. for further details on these materials or the products contained therein.
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http://www.renesas.com
(c) 2003. Renesas Technology Corp., All rights reserved. Printed in Japan.
Colophon 1.0


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